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West Bond Wire Bonder

Contact: Dr. Raluca Gearba
Location: FNT 4.106

Equipment Type:

Cleanroom Instrumentation

Electronic and Optoelectronic Testing

Nano and Micro Fabrication

Information the Equipment Can Provide

The West Bond wire bonder (Model 7476D-79) uses ultrasound to bond wires to metal pads as small as 50 micrometers. 21 bond sites are possible before parting off the wire. The bonder can be used to bond aluminum or gold wires from 0.0007 in. to 0.002 in. diameter by the wedge-wedge technique using ultrasonic energy. The aluminum wire is usually attached at room temperature, while the gold wire is attached by adding heat.


  • The system is set up for 0.00125 inch or 31.75 microns diameter aluminum wire.
  • The system has the ability to bond both gold and aluminum wires of varying thicknesses.
  • The work surface can be viewed through a binocular microscope while bonds are being made.
  • The stage can be heated to change bonding characteristics.

Useful Documentation

Fees and Policies

  • UT Users: $31/hour
  • Higher Education/State Agencies: $54/hour
  • Corporate/External Users: $46/hour

To become a new user of this facility, please read the Instrument Reservation Information page. If you are already a user you can make a reservation in FBS.

To become a user of this instrument you must first complete the Cleanroom Safety Class. Please contact the facility manager to schedule a training session.