Equipment Type:

Cleanroom Instrumentation

Thin Film Fabrication

Instrument Capabilities

Provides thin-film deposition through electron-beam evaporation and magnetron sputtering, enabling controlled deposition of a wide range of metallic and other materials

System Characteristics:

• E-beam evaporation: Four 15 cc electron-beam sources for deposition of metals and selected oxides.
• RF sputtering: One RF sputtering head for deposition of oxides and metals.
• DC sputtering: One DC sputtering head for deposition of metals.
• Sputtering targets: 3-inch diameter targets with thicknesses of 1/8–1/4 inch.
• Base pressure: Approximately 5 × 10⁻⁷ Torr, achieved after overnight pumping.
• Thickness monitoring: Film thickness is monitored using a quartz crystal sensor (QCM).
• Sample handling: Sample rotation is available during deposition.
• Process control: The entire deposition process is manually controlled

All other materials must be provided by the user.

Fees and Policies

Cleanroom Entry fee: (The cleanroom entry fee is charged in addition to the cleanroom facility usage fee)

• UT Users: $6
• Higher Education/State Agencies: $10
• Corporate/External Users: $10

Cleanroom Facility

• UT Users: $35/hour
• Higher Education/State Agencies (Assisted): $92/hour
• Corporate/External Users (Assisted): $94/hour
• Higher Education/State Agencies (Unassisted): $64/hour
• Corporate/External Users (Unassisted): $65/hour

Please contact Dr. Raluca Gearba and/or James Smitherman to schedule a training session.