Equipment Type:

Cleanroom Instrumentation

Nano and Micro Fabrication

Plasma Etching and Material Growth

Instrument Capabilities

The reactive ion etcher is capable of etching oxides, nitrides as well as remove organic contamination from sample surfaces. The unit is outfitted with 4 mass flow controllers for reproducible gas flow.

Key Features:

• AAvailable etch gases: CF₄, SF₆, O₂, and Ar.
• Electrode size: 6-inch.
• Maximum power: 600 W.
• Operating limit: Operate the system only up to 300 W. At 300 W, limit operation to 10 minutes at a time. For operation above 300 W, contact TMI staff for assistance.

Fees and Policies

• UT Users: $35/hour
• Higher Education/State Agencies (Assisted): $92/hour
• Corporate/External Users (Assisted): $94/hour
• Higher Education/State Agencies (Unassisted): $64/hour
• Corporate/External Users (Unassisted): $65/hour

A cleanroom entry fee will be charged in addition to the cleanroom facility usage fee.

• UT Users $6
• Higher Education/State Agencies: $10
• Corporate/External Users: $10

Traning

Users should register for the required in-person training course through UTLearn.