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March Plasma CS170IF RIE Etching System

Contact: Dr. Raluca Gearba
Location: FNT 4.106

Equipment Type:

Cleanroom Instrumentation

Nano and Micro Fabrication

Plasma Etching and Material Growth

Information the Equipment Can Provide

The reactive ion etcher is capable of etching oxides, nitrides as well as remove organic contamination from sample surfaces. The unit is outfitted with 4 mass flow controllers for reproducible gas flow.

The system can be currently operated only in manual mode.

System Characteristics:

  • Available gases: CF4, SF6, O2 and Ar etch chemistry
  • 6-inch electrode
  • Maximum power: 600W
  • Note: Operate the system only up to 300W. At 300W operate only for 10 minutes at a time. Over 300W ask TMI staff for assistance.

Fees and Policies

  • UT Users: $31/hour
  • Higher Education/State Agencies: $54/hour
  • Corporate/External Users: $46/hour

To become a new user of this facility, please read the Instrument Reservation Information page. If you are already a user you can make a reservation in FBS.

To become a user of this instrument you must first complete the Cleanroom Safety Class. Please contact the facility manager to schedule a training session.