Equipment Type:

Cleanroom Instrumentation

Nano and Micro Fabrication

Plasma Etching and Material Growth

Instrument Capabilities

The reactive ion etcher is capable of etching oxides, nitrides as well as remove organic contamination from sample surfaces. The unit is outfitted with 4 mass flow controllers for reproducible gas flow.

System Characteristics:

• AAvailable etch gases: CF₄, SF₆, O₂, and Ar.
• Electrode size: 6-inch.
• Maximum power: 600 W.
• Operating limit: Operate the system only up to 300 W. At 300 W, limit operation to 10 minutes at a time. For operation above 300 W, contact TMI staff for assistance.

Fees and Policies

Cleanroom Entry fee: (The cleanroom entry fee is charged in addition to the cleanroom facility usage fee)

• UT Users: $6
• Higher Education/State Agencies: $10
• Corporate/External Users: $10

Cleanroom Facility

• UT Users: $35/hour
• Higher Education/State Agencies (Assisted): $92/hour
• Corporate/External Users (Assisted): $94/hour
• Higher Education/State Agencies (Unassisted): $64/hour
• Corporate/External Users (Unassisted): $65/hour

Please contact Dr. Raluca Gearba and/or James Smitherman to schedule a training session.