Equipment Type:

Cleanroom Instrumentation

Nano and Micro Fabrication

Instrument Capabilities

The Disco dicing saw is an automatic dicing saw capable of cutting wafers up to 6” diameter. High speed diamond blade produces accurate cuts with minimal chipping. Ultrapure water is flowed onto the blade to keep blade and sample cool during cutting.

TMI offers the 00777-V045-011-QKP blade from Advanced Dicing Technologies.

Blade characteristics:

• Hubless resin-bond diamond blades for cutting silicon, quartz, and ceramics.
• Outer diameter: 55.6 mm
• Inner diameter: 40 mm
• Blade thickness: 0.011 inches
• Grit size: 40–60

TMI staff can assist users in replacing the blade with one that is more appropriate for specific processes.

Fees and Policies

• UT Users: $35/hour
• Higher Education/State Agencies (Assisted): $92/hour
• Corporate/External Users (Assisted): $94/hour
• Higher Education/State Agencies (Unassisted): $64/hour
• Corporate/External Users (Unassisted): $65/hour

A cleanroom entry fee will be charged in addition to the cleanroom facility usage fee.

• UT Users $6
• Higher Education/State Agencies: $10
• Corporate/External Users: $10

Traning

Users should register for the required in-person training course through UTLearn.