Equipment: March Plasma CS170IF RIE etching system
The reactive ion etcher is capable of etching oxides, nitrides and III-V semiconductors as well as remove organic contamination from sample surfaces. The unit is outfitted with 4 mass flow controllers for reproducible gas flow. Currently the system is using CF4, SF6, O2, N2, and Ar etch chemistry.
$25.00 per hour for UT Austin users
$54.00 per hour for external university users
$65.00 per hour for corporate users
Facility User Education
To become a user of this instrument please sign up for the next available NT201 and NT230 facility user education classes. External/Corporate users must contact CNM to setup an account before attending facility user education classes.
NT201 Cleanroom Safety Fee: $25.00
NT230 Reactive Ion Etcher Fee: $25.00
Dr. Damon Smith