Equipment: March Plasma CS170IF RIE etching system

Description

The reactive ion etcher is capable of etching oxides, nitrides and III-V semiconductors as well as remove organic contamination from sample surfaces. The unit is outfitted with 4 mass flow controllers for reproducible gas flow. Currently the system is using CF4, SF6, O2, N2, and Ar etch chemistry.

Location

CNM Cleanroom

FNT 4.106

Fees

$25.00 per hour for UT Austin users

$54.00 per hour for external university users

$65.00 per hour for corporate users

Facility User Education

To become a user of this instrument please sign up for the next available NT201 and NT230 facility user education classes.  External/Corporate users must contact CNM to setup an account before attending facility user education classes.

NT201 Cleanroom Safety Fee: $25.00

NT230 Reactive Ion Etcher Fee: $25.00

Contact

Dr. Damon Smith

damonsmith@mail.utexas.edu

(512) 232-3695