Equipment: Disco 321 Wafer Dicing Saw
The Disco dicing saw is automatic dicing saw capable of cutting wafers up to 6” diameter. High speed diamond blade produces accurate cuts with minimal chipping. Ultrapure water is flowed onto the blade to keep blade and sample cool during cutting.
$25.00 per hour for UT Austin users
$54.00 per hour for external university users
$65.00 per hour for corporate users
Facility User Education
To become a user of this instrument please sign up for the next available NT201 and NT233 facility user education classes. External/Corporate users must contact CNM to setup an account before attending facility user education classes.
NT201 Cleanroom Safety Fee: $25.00
NT233 Dicing Saw Fee: $62.00
Dr. Joshua Bolinger